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Tech & Startups

TSMC breaks ground on more advanced packaging fabs in Chiayi

The Next Web 13 July 2026, 08:24 UTC 2h ago

TSMC breaks ground on more advanced packaging fabs in Chiayi — The Next Web

TSMC will build additional advanced packaging fabs in the second phase of the Chiayi Science Park in southern Taiwan, National Science and Technology Council minister Wu Cheng-wen said at a groundbreaking ceremony on Sunday. Packaging is where the AI supply chain currently pinches, and it is the same constraint that Nvidia’s multi-year HBM4 deal with SK Hynix […] This story continues at The Next Web

This story was reported by The Next Web. EUROPES curates Europe's most relevant coverage — read the full report at the original source.

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